Capabilities

Services & capacity

From die-level test through module shipment and test equipment—scalable, end-to-end options.

Service

Memory IC test services

Specs: DDR4 / DDR5, LPDDR4(X) / LPDDR5
Density: 4G / 8G / 16G / 32G / 64G, multiple DIMM / device flows
Volume: Annual targets scaling upward (see homepage metrics).

Ideal for OEMs and module houses needing fast-ramp system-board memory IC test.

RSTi-MT

Memory module manufacturing

Config: DDR5 x8 / x16
Capacity: 16GB–64GB
Speed: 4800–7600 Mbps
Output: Adjusted to customer forecast rolls.

Module lines and process takt can align with your NPI plan.

Equipment

RSTi-M3 / LM5 automated testers

Platform: DDR4 / DDR5 / LPDDR4 / LPDDR4x
Topology: e.g. 168 DUT / 256 DUT (x8 / x16; LPDDR x32)
Use case: Build or expand test floors, strategic backup capacity.

Operator and maintenance training plus FAE support available.

Inquiries & program bring-up

Accepted specs, fixtures, and capacity are confirmed per project. For pilot schedules, throughput targets, or equipment plans, please use the contact page—sales and FAE will respond.